The North America advanced IC substrates market is anticipated to grow at a CAGR of 6.8% annually in the forecast period, reaching a value of $1,919.2 million by 2031. This growth is primarily driven by the increasing adoption of advanced substrates in electronics manufacturing, the growing prevalence and functionality of consumer electronic products like smart devices and wearables, and the rising penetration of advanced technologies such as 5G and IoT connected devices.
Report Overview:
This comprehensive 125-page report, titled “North America Advanced IC Substrates Market 2022-2031,” provides an in-depth analysis of the entire North America advanced IC substrates market and its sub-segments. The report utilizes extensively detailed classifications to generate profound analysis and assessment from premium primary and secondary information sources. Inputs from industry professionals across the value chain have been incorporated. The research is based on studies conducted between 2021 and 2022, with a forecast period from 2023 to 2031, using 2022 as the base year. (Note: The report will be updated before delivery to ensure the latest historical year is used as the base year, and the forecast covers at least 5 years beyond the base year.)
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Key Highlights:
- Market Structure
- Growth Drivers
- Restraints and Challenges
- Emerging Product Trends & Market Opportunities
- Porter’s Five Forces Analysis
Selected Key Players:
- ASE Group
- AT&S Austria Technologie & Systemtechnik AG
- Fujitsu Ltd.
- IBIDEN Co., Ltd.
- Kinsus Interconnect Technology Corp.
- Korea Circuit Co., Ltd.
- KYOCERA Corporation
- LG Innotek Co., Ltd.
- Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
- Shenzhen Fastprint Circuit Tech
- Shinko Electric Industries Co., Ltd.
- Siliconware Precision Industries Co., Ltd.
- STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)
- TTM Technologies Inc.
- Unimicron Corporation
- Zhen Ding Technology Holding Ltd.
- Zhuhai ACCESS Semiconductor
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Appendices: Supplementary materials such as additional data, charts, or supporting documents that are relevant to the report but not included in the main body.
Conclusion: Summarizes the key points discussed in the report and reinforces the main findings.
Segmentation Analysis:
- Packaging Type:
- FC BGA
- FC CSP
- Other Packaging Types
- Material Type:
- Rigid Integrated Circuit Substrate
- Flex Integrated Circuit Substrate
- Ceramic Integrated Circuit Substrate
- Manufacturing Method:
- Subtraction Process (SP)
- Addition Process (AP)
- Modified Semi-additive Process (MSAP)
- Bonding Technology:
- Wire Bonding
- FC Bonding
- Tape Automated Bonding (TAB)
- Application:
- Mobile and Consumer Electronics
- Automotive and Transportation
- IT and Telecom
- Other Applications
Geographical Analysis:
- U.S.
- Canada
- Mexico
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